LionCircuits, a global leader in PCB manufacturing, offers complete EMS solutions through our software-driven platform. From prototyping to production, we streamline PCB fabrication, assembly, and component sourcing. Explore our capabilities and reach out for tailored support.
Rigid PCB
Explore our Rigid PCB services: Choose from Make in India, Custom designs, or Rush delivery for fast, reliable, and affordable solutions.
MII Service
Custom Service
Rush Service
Minimum Board Dimension
3mm * 3mm
3mm * 3mm
3mm * 3mm
Board Layers
2 and 4 Layers
1,2,4,6,8,10,12 Layers. *6 and above layer Boards on sales@lioncircuits.com
1,2,4,6,8,10,12 Layers. *6 and above layer Boards on sales@lioncircuits.com
Copper Weight
1oz(35um)
1oz(35um), 2oz(70um), 3oz(105um)
1oz(35um),2oz(70um)
Board Thickness Tolerance
± 10%
± 10%
± 10%
Minimum trace spacing/width
For 1oz: 6/6mil
For 1oz: 6/6 mil For 2oz: 10/10 mil For 3oz: 12/12 mil
For 1oz: 8/8mil For 2oz: 10/10mil
Annular Rings
0.152mm/6mil
0.152mm/6mil
0.152mm/6mil
Minimum distance between Trace and Copper Pour
For 1oz = 6mil
For 1oz = 6mil For 2oz = 10mil For 3oz=12mil
For 1oz = 8mil For 2oz = 12mil
Circuit to edge
= 0.3mm /12mil
= 0.3mm /12mil
= 0.3mm /12mil
Minimum distance between Vias (plated holes)
= 12mil
= 10mil
= 14mil
Minimum distance between Silk Screen and Solder Pad
= 6mil
= 6mil
= 8mil
Width of Solder Mask Dam
=0.152mm/6mil
=0.152mm/6mil
=0.25mm/10mil
Minimum distance between Via(plated holes) and trace
= 12mil
= 10mil
= 14mil
Drill Hole Diameter(Mechanical)
0.35 - 6.3mm
0.25 - 6.3mm
0.4 - 6.3mm
Minimum silkscreen height/trace width
height = 0.5842mm /23mil trace width = 0.152mm /6mil
height = 0.5842mm /23mil trace width = 0.152mm /6mil
height = 0.5842mm /23mil trace width = 0.152mm /6mil
Edge Castellation
No
Yes
No
Minimum diameter for slots
0.8mm
0.8mm
0.8mm
Minimum Board Dimension
3mm * 3mm
Board Layers
2 and 4 Layers
Copper Weight
1oz(35um)
Board Thickness Tolerance
± 10%
Minimum trace spacing/width
For 1oz: 6/6mil
Annular Rings
0.152mm/6mil
Minimum distance between Trace and Copper Pour
For 1oz = 6mil
Minimum distance between Trace and Copper Pour
For 1oz = 6mil
Circuit to edge
= 0.3mm /12mil
Minimum distance between Vias (plated holes)
= 12mil
Minimum distance between Silk Screen and Solder Pad
= 6mil
Width of Solder Mask Dam
=0.152mm/6mil
Minimum distance between Via(plated holes) and trace
= 12mil
Drill Hole Diameter(Mechanical)
0.35 - 6.3mm
Minimum silkscreen height/trace width
height = 0.5842mm /23mil trace width = 0.152mm /6mil
Edge Castellation
No
Minimum diameter for slots
0.8mm
Got Queries?
![PCB gerber file](/_next/image?url=%2FZip.webp&w=256&q=75)
PCB gerber file
The Gerber file format (RS274X) is the industry standard for PCB fabrication, detailing all board layers including copper, solder mask, and legend. When uploading your designs to our platform, Gerber files can be submitted in either .rar or .zip archives for seamless processing.
![Board Outline file (.GKO)](/_next/image?url=%2FOutline.webp&w=256&q=75)
Board Outline file (.GKO)
File essential for routing the board edge, as it defines the PCB's outline, including any inner slots or cut-outs. This file must contain only outline data, with no additional information included, ensuring precise cutting during fabrication.
![Drill files](/_next/image?url=%2FDrill.webp&w=256&q=75)
Drill files
These should be provided in Excellon format. Non-Plated Through Holes (NPTH) can be specified either within the board outline file or in a separate drill file labeled with 'NPTH' in the filename.
PCB File Extensions and Layers
In PCB design, specific file extensions are crucial for accurate fabrication. The Top Copper Layer (GTL) and Bottom Copper Layer (GBL) define the circuitry, while the Top (GTS) and Bottom Solder Mask (GBS) files specify solder mask application areas. The Top (GTO) and Bottom Silk Screen (GBO) files provide markings for component placement. The Board Outline file (GKO) defines the PCB's shape, and the Drills file (DRD) details hole locations for component mounting, ensuring precise manufacturing and functionality.
File Extension
filename.GTL
filename.GBL
filename.GTS
filename.GBS
filename.GTO
filename.GBO
filename.GKO
filename.DRD
Layer
Top Copper Layer
Bottom Copper Layer
Top SolderMask
Bottom SolderMask
Top SilkScreen
Bottom SilkScreen
Board Outline
Drills
File Extension
filename.GTL
filename.GBL
filename.GTS
filename.GBS
filename.GTO
filename.GBO
filename.GKO
filename.DRD
Layer
Top Copper Layer
Bottom Copper Layer
Top SolderMask
Bottom SolderMask
Top SilkScreen
Bottom SilkScreen
Board Outline
Drills
prototype to production:
With you at every step
From initial concept to final product, we ensure seamless support at every stage of your manufacturing journey.
Multi-Layer PCB
support multilayer printed circuit boards upto 12 layers including impedance control.
7628, 2116, 2113, 1080 and 106 type prepreg, other prepreg type can be procured on request.
Core material: NP-140, NP-170, 185HR and 370HR grade. We support other special core on request.
Inner/Outer layer copper finish can be 1oz or 2 oz.
Stack-Up Details
Layer
Top Layer1
Prepreg
Inner Layer2
Core
Inner Layer3
Prepreg
Bottom Layer4
Material type
Copper
2116*1
Copper
NP-140
Copper
2116*1
Copper
Thickness
0.035 mm
0.12 mm
0.035 mm
1.165 mm
0.035 mm
0.12 mm
0.035 mm
x
x
x
x
1.2 mm (with copper core)
x
x
x
Layer
Top Layer1
Prepreg
Inner Layer2
Core
Inner Layer3
Prepreg
Bottom Layer4
Material type
Copper
2116*1
Copper
NP-140
Copper
2116*1
Copper
Thickness
0.035 mm
0.12 mm
0.035 mm
1.165 mm
0.035 mm
0.12 mm
0.035 mm
x
x
x
x
1.2 mm (with copper core)
x
x
x
standard file format
Layer-by-layer precision: Our standard file format ensuring seamless 4 and 6-layer PCB designs, ready for accurate fabrication.
Layer
Layer (L1)
Inner Layer 2 (L2)
Inner Layer 3 (L3)
Layer (L4)
Inner Layer 5 (L5)
Layer (L6)
4 layers std format
TOP.GTL
INNER_2.G2L
INNER_3.G3L
BOTTOM.GBL
-
-
6 Layers std format
TOP.GTL
INNER_2.G2L
INNER_3.G3L
INNER_4.G4L
INNER_5.G5L
BOTTOM.GBL
Layer
Layer (L1)
Inner Layer 2 (L2)
Inner Layer 3 (L3)
Layer (L4)
Inner Layer 5 (L5)
Layer (L6)
4 layers std format
TOP.GTL
INNER_2.G2L
INNER_3.G3L
BOTTOM.GBL
-
-
6 Layers std format
TOP.GTL
INNER_2.G2L
INNER_3.G3L
INNER_4.G4L
INNER_5.G5L
BOTTOM.GBL
PCB Assembly
Assemble with precision, deliver with confidence. Our PCB assembly services offer tailored solutions for seamless integration.
Assembly Types
Surface mount and through hole assembly on one or both sides of the PCB.
Assembly Quality
Fully automated state-of-the-art assembly line for unparalleled quality, reliable and timely delivery.
Stencil Options
Support for both frameless and framed stainless steel metal stencils for solder paste application. Framed stencils mandatory for certain components.
Lead Options
Both leaded and lead-free (RoHS) assembly options available.
Minimum Board Size
50mm x 100mm for machine assembly, smaller boards need to be panelized.
Component Support
Components in Reel, Cut-tapes, and Tray formats supported.
Circuit Board Shape
Non-rectangular boards must be panelized with side rails (5mm) on the longer edge for machine assembly.
begin with
BOM upload
Jumpstart your PCB assembly process by uploading your Bill of Materials (BOM) to receive instant automated quotes based on your gerber and BOM combination.
![orange wave graphic](/_next/image?url=%2FPCB4.webp&w=3840&q=75)
PCB Component Sourcing
support multilayer printed circuit boards upto 12 layers including impedance control.
Turn-Key Assembly (Full Turn-Key and Partial Turn-Key Support)
Component Procurement Tool with BOM Management Software
SMT Stencil Options (Frameless and Framed)
![view demo](/_next/image?url=%2FPlay.webp&w=96&q=75)
View Demo
BOM Management and Component Procurement
Our BOM Management Software and Component Procurement Tool are integral parts of our turn-key assembly services. These tools are designed to streamline the process of refining BOMs (Bill of Materials) and efficiently sourcing components for your projects. With our software-driven approach, you can easily optimize your BOMs, identify the right vendors and part numbers, and ensure a smooth ordering process for components. Our goal is to simplify the procurement journey and provide you with a comprehensive solution for managing your assembly requirements.
Automatic Assembly Selection
Selecting 'Automatic Assembly' is a crucial step in choosing the right stencils for your assembly process. Our Automatic Assembly feature ensures compatibility and optimal performance with our SMT stencil options. To guide you through this selection process and ensure seamless integration with our assembly services, we provide comprehensive guidance and support. Explore the benefits of Automatic Assembly and make informed decisions for your projects by following our expert guidance.
SMT Stencil Options
When it comes to SMT (Surface Mount Technology) stencil options, we offer a range of choices to meet your specific needs. Our offerings include both frameless and framed stainless steel metal stencils for solder paste application. It's important to note that framed stencils are essential, especially for components like BGA, QFN, or 0402 components, even for prototype quantities. To delve deeper into our SMT stencil options and understand their significance, click the button below to learn more about SMT Stencils.
![orange wave graphic](/_next/image?url=%2FHandshake.webp&w=3840&q=75)
we value your
time & money
At LionCircuits, we prioritize efficiency and affordability. With our streamlined processes and commitment to excellence, we deliver high-quality PCBs that meet your deadlines and budget.
![orange wave graphic](/_next/image?url=%2FHandshake.webp&w=3840&q=75)
Functional Testing
support multilayer printed circuit boards upto 12 layers including impedance control.
Advanced Intelligence-Driven Visual Inspection
Upon completion of the PCBA process, we utilize our proprietary machine learning-based Advanced Intelligence-Driven visual inspection system. This system is designed for quality assurance, leveraging AI algorithms to detect defects and anomalies. With each test cycle, the system continuously learns and improves its accuracy, ensuring optimal performance.
Current Pass Rate
>99%
Additional Functional Testing
In addition to visual inspection, we conduct a range of functional tests to validate the board's performance
Short/Open check
device-fireware-upgrades (DFU)
Digital/analog testing
power-up testing
Votage tests on board
Specialised testing for batch sizes and components
Specialised testing for components & batch sizes
Tailored testing solutions to ensure the quality and reliability of your components, regardless of batch size
For batch sizes of 50 or more, we recommend defining a customized test procedure to meet your specific requirements.
We support Device Firmware Upgrades and Test Firmware using standard Jigs for boards with microcontrollers.
BGA/QFN assemblies undergo rigorous inspection using an X-ray inspection system to ensure quality and reliability.
![orange wave graphic](/_next/image?url=%2FPCB2.webp&w=1920&q=75)
Have an innovative
Idea?
Schedule a one-on-one meeting with a member of our sales team for personalized assistance and insights.
![orange wave graphic](/_next/image?url=%2FPCB2.webp&w=1920&q=75)