PN5321A3HN/C106,55
Manufacturer
NXP Semiconductors
Description
Tray, Bakeable, Multiple in Drypack, Nfc Integrated Solution, Tray Rohs Compliant: Yes
Datasheet
DownloadProduct Attributes
Type
Case/Package
Contact Plating
Frequency
Lead Free
Max Frequency
Max Operating Temperature
Max Supply Voltage
Min Operating Temperature
Min Supply Voltage
Mount
Number of Pins
Operating Supply Current
Radiation Hardening
REACH SVHC
RoHS
Weight
Description
QFN
Gold
13.56 MHz
Lead Free
13.56 MHz
85 °C
5.5 V
-40 °C
2.7 V
Surface Mount
40
12 µA
No
No SVHC
Compliant
117.310327 mg
Product Attributes
Type
Case/Package
Contact Plating
Frequency
Lead Free
Max Frequency
Max Operating Temperature
Max Supply Voltage
Min Operating Temperature
Min Supply Voltage
Mount
Number of Pins
Operating Supply Current
Radiation Hardening
REACH SVHC
RoHS
Weight
Description
QFN
Gold
13.56 MHz
Lead Free
13.56 MHz
85 °C
5.5 V
-40 °C
2.7 V
Surface Mount
40
12 µA
No
No SVHC
Compliant
117.310327 mg
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