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HK10055N6S-T

Manufacturer

Taiyo Yuden

Description

Ind High Frequency Chip Multi-Layer 5.6nH 0.3nH 100MHz 8Q-Factor Ceramic 430mA 0402 T/R

Datasheet

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Product Attributes

Type

Case/Package

Case Code (Imperial)

Case Code (Metric)

Core Material

Current Rating

DC Current

DC Resistance (DCR)

Depth

Halogen Free

Height

Height - Seated (Max)

Inductance

Lead Free

Length

Max DC Current

Max Length

Max Operating Temperature

Max Width

Military Standard

Min Length

Min Operating Temperature

Min Width

Mount

Number of Pins

Packaging

Q Factor

Radiation Hardening

REACH SVHC

RoHS

Schedule B

Self Resonant Frequency

Shielding

Termination

Test Frequency

Weight

Width

Description

0402

0402

1005

Ceramic, Ferrite

300 mA

430 mA

230 mΩ

550 µm

Halogen Free

500 µm

558.8 µm

5.6 nH

Exempt

990.6 µm

300 mA

1.05 mm

125 °C

550 µm

Not

950 µm

-55 °C

450 µm

Surface Mount

2

Cut Tape (CT)

8

No

Unknown

Compliant

8504500000

4 GHz

Unshielded

SMD/SMT

100 MHz

652.039032 µg

500 µm

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Product Attributes

Type

Case/Package

Case Code (Imperial)

Case Code (Metric)

Core Material

Current Rating

DC Current

DC Resistance (DCR)

Depth

Halogen Free

Height

Height - Seated (Max)

Inductance

Lead Free

Length

Max DC Current

Max Length

Max Operating Temperature

Max Width

Military Standard

Min Length

Min Operating Temperature

Min Width

Mount

Number of Pins

Packaging

Q Factor

Radiation Hardening

REACH SVHC

RoHS

Schedule B

Self Resonant Frequency

Shielding

Termination

Test Frequency

Weight

Width

Description

0402

0402

1005

Ceramic, Ferrite

300 mA

430 mA

230 mΩ

550 µm

Halogen Free

500 µm

558.8 µm

5.6 nH

Exempt

990.6 µm

300 mA

1.05 mm

125 °C

550 µm

Not

950 µm

-55 °C

450 µm

Surface Mount

2

Cut Tape (CT)

8

No

Unknown

Compliant

8504500000

4 GHz

Unshielded

SMD/SMT

100 MHz

652.039032 µg

500 µm

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