Manufacturer
TE Connectivity
Description
Res Pulse Withstand Thick Film 2010 33 Ohm 1% 1.25W 100ppm/C Molded Emboss T/R
Datasheet
DownloadType
Ambient Temperature Range High
Case/Package
Composition
Height
Lifecycle Status
Manufacturer Lifecycle Status
Max Operating Temperature
Min Operating Temperature
Packaging
Power Rating
Resistance
RoHS
Temperature Coefficient
Voltage Rating
Voltage Rating (DC)
Description
70 °C
2010
Thick Film
650 µm
Production (Last Updated: 6 days ago)
ACTIVE (Last Updated: 6 days ago)
155 °C
-55 °C
Cut Tape
1.25 W
33 Ω
Non-Compliant
100 ppm/°C
400 V
400 V
Type
Ambient Temperature Range High
Case/Package
Composition
Height
Lifecycle Status
Manufacturer Lifecycle Status
Max Operating Temperature
Min Operating Temperature
Packaging
Power Rating
Resistance
RoHS
Temperature Coefficient
Voltage Rating
Voltage Rating (DC)
Description
70 °C
2010
Thick Film
650 µm
Production (Last Updated: 6 days ago)
ACTIVE (Last Updated: 6 days ago)
155 °C
-55 °C
Cut Tape
1.25 W
33 Ω
Non-Compliant
100 ppm/°C
400 V
400 V
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