CPF0805B4K7E1
Manufacturer
TE Connectivity
Description
Res Thin Film 0805 4.7K Ohm 0.1% 1/10W 25ppm/C Molded SMD SMD Paper T/R
Datasheet
DownloadProduct Attributes
Type
Case/Package
Case Code (Imperial)
Case Code (Metric)
Composition
Contact Plating
Depth
ELV
Height
Length
Lifecycle Status
Manufacturer Lifecycle Status
Max Operating Temperature
Max Power Dissipation
Military Standard
Min Operating Temperature
Mount
Number of Pins
Number of Resistors
Number of Terminations
Packaging
Power Rating
Radiation Hardening
REACH SVHC
Resistance
RoHS
Schedule B
Temperature Coefficient
Termination
Tolerance
Voltage Rating
Voltage Rating (DC)
Weight
Width
Description
0805
0805
2012
Thin Film
Tin
1.25 mm
Compliant
550 µm
2 mm
Production (Last Updated: 1 day ago)
ACTIVE (Last Updated: 1 day ago)
155 °C
100 mW
Not
-55 °C
Surface Mount
2
1
2
Cut Tape (CT)
100 mW
No
No SVHC
4.7 kΩ
Compliant
8533210045, 8533210080|8533210080|8533210080|8533210080|8533210080
25 ppm/°C
Solder
0.1 %
100 V
200 V
5.499807 mg
1.25 mm
Product Attributes
Type
Case/Package
Case Code (Imperial)
Case Code (Metric)
Composition
Contact Plating
Depth
ELV
Height
Length
Lifecycle Status
Manufacturer Lifecycle Status
Max Operating Temperature
Max Power Dissipation
Military Standard
Min Operating Temperature
Mount
Number of Pins
Number of Resistors
Number of Terminations
Packaging
Power Rating
Radiation Hardening
REACH SVHC
Resistance
RoHS
Schedule B
Temperature Coefficient
Termination
Tolerance
Voltage Rating
Voltage Rating (DC)
Weight
Width
Description
0805
0805
2012
Thin Film
Tin
1.25 mm
Compliant
550 µm
2 mm
Production (Last Updated: 1 day ago)
ACTIVE (Last Updated: 1 day ago)
155 °C
100 mW
Not
-55 °C
Surface Mount
2
1
2
Cut Tape (CT)
100 mW
No
No SVHC
4.7 kΩ
Compliant
8533210045, 8533210080|8533210080|8533210080|8533210080|8533210080
25 ppm/°C
Solder
0.1 %
100 V
200 V
5.499807 mg
1.25 mm
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