CPF0805B11RE1
Manufacturer
TE Connectivity
Description
Res Thin Film 0805 11 Ohm 0.1% 0.1W(1/10W) ±25ppm/C Epoxy Pad SMD T/R
Datasheet
DownloadProduct Attributes
Type
Case/Package
Case Code (Imperial)
Case Code (Metric)
Composition
Contact Plating
Depth
ELV
Height
Length
Lifecycle Status
Manufacturer Lifecycle Status
Max Operating Temperature
Max Power Dissipation
Military Standard
Min Operating Temperature
Mount
Number of Resistors
Number of Terminations
Operating Supply Voltage
Power Rating
Radiation Hardening
Resistance
RoHS
Temperature Coefficient
Termination
Tolerance
Voltage Rating
Voltage Rating (DC)
Weight
Width
Description
0805
0805
2012
Thin Film
Tin
1.25 mm
Compliant
550 µm
2 mm
Production (Last Updated: 2 days ago)
ACTIVE (Last Updated: 2 days ago)
155 °C
100 mW
Not
-55 °C
Surface Mount
1
2
100 V
100 mW
No
11 Ω
Compliant
25 ppm/°C
Solder
0.1 %
100 V
100 V
5.499807 mg
1.2446 mm
Product Attributes
Type
Case/Package
Case Code (Imperial)
Case Code (Metric)
Composition
Contact Plating
Depth
ELV
Height
Length
Lifecycle Status
Manufacturer Lifecycle Status
Max Operating Temperature
Max Power Dissipation
Military Standard
Min Operating Temperature
Mount
Number of Resistors
Number of Terminations
Operating Supply Voltage
Power Rating
Radiation Hardening
Resistance
RoHS
Temperature Coefficient
Termination
Tolerance
Voltage Rating
Voltage Rating (DC)
Weight
Width
Description
0805
0805
2012
Thin Film
Tin
1.25 mm
Compliant
550 µm
2 mm
Production (Last Updated: 2 days ago)
ACTIVE (Last Updated: 2 days ago)
155 °C
100 mW
Not
-55 °C
Surface Mount
1
2
100 V
100 mW
No
11 Ω
Compliant
25 ppm/°C
Solder
0.1 %
100 V
100 V
5.499807 mg
1.2446 mm
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