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CIH05T2N7SNC
Manufacturer
Samsung
Description
Ind High Frequency Chip Multi-Layer 2.7nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 Paper T/R
Datasheet
DownloadProduct Attributes
Type
Case/Package
Case Code (Imperial)
Case Code (Metric)
Core Material
Current Rating
DC Current
DC Resistance (DCR)
Depth
Height
Inductance
Length
Lifecycle Status
Max Current Rating
Max DC Current
Max Operating Temperature
Military Standard
Min Operating Temperature
Mount
Packaging
Radiation Hardening
RoHS
Schedule B
Self Resonant Frequency
Shielding
Test Frequency
Width
Description
0402
0402
1005
Ceramic
300 mA
300 mA
170 mΩ
550 µm
550 µm
2.7 nH
990.6 µm
Production (Last Updated: 2 years ago)
300 mA
300 mA
125 °C
Not
-55 °C
Surface Mount
Tape & Reel
No
Compliant
8504500000|8504500000|8504500000|8504500000|8504500000
6 GHz
Unshielded
100 MHz
508 µm
Product Attributes
Type
Case/Package
Case Code (Imperial)
Case Code (Metric)
Core Material
Current Rating
DC Current
DC Resistance (DCR)
Depth
Height
Inductance
Length
Lifecycle Status
Max Current Rating
Max DC Current
Max Operating Temperature
Military Standard
Min Operating Temperature
Mount
Packaging
Radiation Hardening
RoHS
Schedule B
Self Resonant Frequency
Shielding
Test Frequency
Width
Description
0402
0402
1005
Ceramic
300 mA
300 mA
170 mΩ
550 µm
550 µm
2.7 nH
990.6 µm
Production (Last Updated: 2 years ago)
300 mA
300 mA
125 °C
Not
-55 °C
Surface Mount
Tape & Reel
No
Compliant
8504500000|8504500000|8504500000|8504500000|8504500000
6 GHz
Unshielded
100 MHz
508 µm
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