No Image Found
CE201210-39NJ
Manufacturer
Bourns
Description
Ind Chip Multi-Layer 39nH 5% 100MHz 23Q-Factor Ceramic 300mA 0805 T/R
Datasheet
DownloadProduct Attributes
Type
Case/Package
Case Code (Imperial)
Case Code (Metric)
Core Material
Current Rating
DC Resistance (DCR)
Depth
Height
Height - Seated (Max)
Inductance
Length
Max DC Current
Max Operating Temperature
Min Operating Temperature
Mount
Packaging
Q Factor
Radiation Hardening
RoHS
Self Resonant Frequency
Shielding
Termination
Test Frequency
Tolerance
Width
Description
0805
0805
2012
Ceramic
300 mA
650 mΩ
1.45 mm
830 µm
1.0414 mm
39 nH
2.0066 mm
300 mA
125 °C
-55 °C
Surface Mount
Tape & Reel (TR)
23
No
Compliant
1 GHz
Unshielded
SMD/SMT
100 MHz
5 %
1.25 mm
Product Attributes
Type
Case/Package
Case Code (Imperial)
Case Code (Metric)
Core Material
Current Rating
DC Resistance (DCR)
Depth
Height
Height - Seated (Max)
Inductance
Length
Max DC Current
Max Operating Temperature
Min Operating Temperature
Mount
Packaging
Q Factor
Radiation Hardening
RoHS
Self Resonant Frequency
Shielding
Termination
Test Frequency
Tolerance
Width
Description
0805
0805
2012
Ceramic
300 mA
650 mΩ
1.45 mm
830 µm
1.0414 mm
39 nH
2.0066 mm
300 mA
125 °C
-55 °C
Surface Mount
Tape & Reel (TR)
23
No
Compliant
1 GHz
Unshielded
SMD/SMT
100 MHz
5 %
1.25 mm
prototype to production:
With you at every step
From initial concept to final product, we ensure seamless support at every stage of your manufacturing journey.