CE201210-27NJ
Manufacturer
Bourns
Description
Ind Chip Multi-Layer 27nH 5% 100MHz 23Q-Factor Ceramic 300mA 0805 T/R
Datasheet
DownloadProduct Attributes
Type
Case/Package
Case Code (Imperial)
Case Code (Metric)
Composition
Core Material
Current Rating
DC Current
DC Resistance (DCR)
Depth
Height
Height - Seated (Max)
Inductance
Length
Max DC Current
Max Operating Temperature
Military Standard
Min Operating Temperature
Mount
Packaging
Q Factor
Radiation Hardening
RoHS
Schedule B
Self Resonant Frequency
Shielding
Termination
Test Frequency
Tolerance
Width
Description
0805
0805
2012
Ceramic
Ceramic
300 mA
300 mA
550 mΩ
1.45 mm
203.2 µm
1.0414 mm
27 nH
2.0066 mm
300 mA
125 °C
Not
-55 °C
Surface Mount
Tape & Reel
23
No
Compliant
8504500000, 8504500000|8504500000|8504500000|8504500000|8504500000
1.3 GHz
Unshielded
SMD/SMT
100 MHz
5 %
1.2446 mm
Product Attributes
Type
Case/Package
Case Code (Imperial)
Case Code (Metric)
Composition
Core Material
Current Rating
DC Current
DC Resistance (DCR)
Depth
Height
Height - Seated (Max)
Inductance
Length
Max DC Current
Max Operating Temperature
Military Standard
Min Operating Temperature
Mount
Packaging
Q Factor
Radiation Hardening
RoHS
Schedule B
Self Resonant Frequency
Shielding
Termination
Test Frequency
Tolerance
Width
Description
0805
0805
2012
Ceramic
Ceramic
300 mA
300 mA
550 mΩ
1.45 mm
203.2 µm
1.0414 mm
27 nH
2.0066 mm
300 mA
125 °C
Not
-55 °C
Surface Mount
Tape & Reel
23
No
Compliant
8504500000, 8504500000|8504500000|8504500000|8504500000|8504500000
1.3 GHz
Unshielded
SMD/SMT
100 MHz
5 %
1.2446 mm
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