CE201210-22NJ
Manufacturer
Bourns
Description
Ind Chip Multi-Layer 22nH 5% 100MHz 23Q-Factor Ceramic 300mA 0805 T/R
Datasheet
DownloadProduct Attributes
Type
Case/Package
Case Code (Imperial)
Case Code (Metric)
Composition
Core Material
Current
Current Rating
DC Resistance (DCR)
Depth
Height
Height - Seated (Max)
Inductance
Inductance Tolerance
Length
Max DC Current
Max Operating Temperature
Min Operating Temperature
Mount
Q Factor
Radiation Hardening
RoHS
Schedule B
Self Resonant Frequency
Shielding
Termination
Test Frequency
Tolerance
Width
Description
0805
0805
2012
Ceramic
Ceramic
300 mA
300 mA
500 mΩ
1.45 mm
830 µm
1.0414 mm
22 nH
5 %
2.0066 mm
300 mA
125 °C
-55 °C
Surface Mount
23
No
Compliant
8504500000, 8504500000|8504500000|8504500000|8504500000|8504500000
1.4 GHz
Unshielded
SMD/SMT
100 MHz
5 %
1.25 mm
Product Attributes
Type
Case/Package
Case Code (Imperial)
Case Code (Metric)
Composition
Core Material
Current
Current Rating
DC Resistance (DCR)
Depth
Height
Height - Seated (Max)
Inductance
Inductance Tolerance
Length
Max DC Current
Max Operating Temperature
Min Operating Temperature
Mount
Q Factor
Radiation Hardening
RoHS
Schedule B
Self Resonant Frequency
Shielding
Termination
Test Frequency
Tolerance
Width
Description
0805
0805
2012
Ceramic
Ceramic
300 mA
300 mA
500 mΩ
1.45 mm
830 µm
1.0414 mm
22 nH
5 %
2.0066 mm
300 mA
125 °C
-55 °C
Surface Mount
23
No
Compliant
8504500000, 8504500000|8504500000|8504500000|8504500000|8504500000
1.4 GHz
Unshielded
SMD/SMT
100 MHz
5 %
1.25 mm
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