36501J12NJTDG
Manufacturer
TE Connectivity
Description
Ind High Frequency Chip Unshielded Wirewound 12nH 5% 250MHz 35Q-Factor 700mA 0603 T/R
Product Attributes
Type
Case/Package
Case Code (Imperial)
Case Code (Metric)
Composition
Current Rating
DC Current
DC Resistance (DCR)
Depth
ELV
Height
Inductance
Inductance Tolerance
Lead/Base Style
Length
Lifecycle Status
Manufacturer Lifecycle Status
Max Current Rating
Max DC Current
Max Operating Temperature
Military Standard
Min Operating Temperature
Mount
Q Factor
Radiation Hardening
REACH SVHC
RoHS
Self Resonant Frequency
Shielding
Termination
Test Frequency
Tolerance
Weight
Width
Description
0603
0603
1608
Wirewound
700 mA
700 mA
130 mΩ
1.12 mm
Compliant
450 µm
12 nH
5 %
SMD/SMT
1.6 mm
Production (Last Updated: 1 week ago)
ACTIVE (Last Updated: 1 week ago)
700 mA
700 mA
125 °C
Not
-40 °C
Surface Mount
35
No
Unknown
Compliant
4 GHz
No
SMD/SMT
250 MHz
5 %
3.997283 mg
787.4 µm
Product Attributes
Type
Case/Package
Case Code (Imperial)
Case Code (Metric)
Composition
Current Rating
DC Current
DC Resistance (DCR)
Depth
ELV
Height
Inductance
Inductance Tolerance
Lead/Base Style
Length
Lifecycle Status
Manufacturer Lifecycle Status
Max Current Rating
Max DC Current
Max Operating Temperature
Military Standard
Min Operating Temperature
Mount
Q Factor
Radiation Hardening
REACH SVHC
RoHS
Self Resonant Frequency
Shielding
Termination
Test Frequency
Tolerance
Weight
Width
Description
0603
0603
1608
Wirewound
700 mA
700 mA
130 mΩ
1.12 mm
Compliant
450 µm
12 nH
5 %
SMD/SMT
1.6 mm
Production (Last Updated: 1 week ago)
ACTIVE (Last Updated: 1 week ago)
700 mA
700 mA
125 °C
Not
-40 °C
Surface Mount
35
No
Unknown
Compliant
4 GHz
No
SMD/SMT
250 MHz
5 %
3.997283 mg
787.4 µm
prototype to production:
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