Manufacturer
TE Connectivity / AMP
Description
200 Position 0.6 mm Memory Card Gold Flash Contact Plating SODIMM Socket
Datasheet
DownloadType
Circuit Application
Connector Type
Contact Current Rating
Contact Material
Contact Plating
ELV
Flammability Rating
Housing Color
Housing Material
Insulation Material
Lead Free
Lead Pitch
Lifecycle Status
Max Current Rating
Max Operating Temperature
Memory Type
Min Operating Temperature
Mount
Number of Contacts
Number of Pins
Number of Positions
Number of Rows
Orientation
Packaging
Pitch
Radiation Hardening
REACH SVHC
RoHS
Row Spacing
Sealable
Stack Height
Termination
Voltage Rating
Description
Power
Socket
500 mA
Copper
Gold
Compliant
UL94 V-0
Black
Thermoplastic
Thermoplastic
Lead Free
600 µm
Production (Last Updated: 1 day ago)
500 mA
85 °C
DDR, SDRAM
-67 °C
Surface Mount
200
2
200
2
Right Angle
Tape & Reel
600 µm
No
Unknown
Compliant
6.1976 mm
No
5.2 mm
Solder
1.8 V
Type
Circuit Application
Connector Type
Contact Current Rating
Contact Material
Contact Plating
ELV
Flammability Rating
Housing Color
Housing Material
Insulation Material
Lead Free
Lead Pitch
Lifecycle Status
Max Current Rating
Max Operating Temperature
Memory Type
Min Operating Temperature
Mount
Number of Contacts
Number of Pins
Number of Positions
Number of Rows
Orientation
Packaging
Pitch
Radiation Hardening
REACH SVHC
RoHS
Row Spacing
Sealable
Stack Height
Termination
Voltage Rating
Description
Power
Socket
500 mA
Copper
Gold
Compliant
UL94 V-0
Black
Thermoplastic
Thermoplastic
Lead Free
600 µm
Production (Last Updated: 1 day ago)
500 mA
85 °C
DDR, SDRAM
-67 °C
Surface Mount
200
2
200
2
Right Angle
Tape & Reel
600 µm
No
Unknown
Compliant
6.1976 mm
No
5.2 mm
Solder
1.8 V
From initial concept to final product, we ensure seamless support at every stage of your manufacturing journey.